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Matchplate parts for Aluminum sand cast for Raspberry Pi Zero v 1.3 case
by Anathae
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Design for a case for the Raspberry Pi Zero version 1.3 to be sand cast in Aluminum.
This design has a "riser" to put the top of the CPU/Memory Package on package in contact with the top of the case. Heat dissipation fins that average 1 mm in width run along the short axis on the top.
As this is intended to be sand cast, there is a five degree draft to the vertical surfaces. The two halves of the matchplate have been scaled up to 101% which I understand is the standard shrinkage of Alu
This design has a "riser" to put the top of the CPU/Memory Package on package in contact with the top of the case. Heat dissipation fins that average 1 mm in width run along the short axis on the top.
As this is intended to be sand cast, there is a five degree draft to the vertical surfaces. The two halves of the matchplate have been scaled up to 101% which I understand is the standard shrinkage of Alu
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