Open Model for External Mechanical Stress of Semiconductors and MEMS for Cascade Microtech REL 3600 probe station

This project defines the details of the bending equipment solution and the calibration required for characterization of external mechanical stress in semiconductors and MEMS. The equipment is suited for use in probe station for electrical characterization of devices under controlled external mechanical stress.

References are listed at the bottom.

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The project was developed using the SketchUp 3D modeling software, from Trimble Inc. The bending equipment and t