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Smart Phone Stand - TAEKWONDO
by SPLA
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Materials : SPLA filament 1.75 (Heat-resistance PLA filament)
Nozzle : 0.2 , infill : 10%
extruder temperature : 200
Speed :.70s
Size :100% (150 x 92 x, 50 mm)
Materials : SPLA filament 1.75 (Heat-resistance PLA filament)
Nozzle : 0.2 , infill : 10%
extruder temperature : 200
Speed :.70s
Size :100% (150 x 92 x, 50 mm)
Makes
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