Thingiverse
Phone Stand
by SPLA
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Materials : SPLA filament 1.75 (Heat-resistance PLA filament)
Nozzle : 0.2 , infill : 10%
extruder temperature : 200
Speed :.80s
Size : 32 x 102 x 85 (mm)
Nozzle : 0.2 , infill : 10%
extruder temperature : 200
Speed :.80s
Size : 32 x 102 x 85 (mm)
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