ESPRESSObin Case

Note: This does not fit the ESPRESSObin+ (no support is planned, as an official enclosure is now offered for purchase)

A case for the ESPRESSObin board, designed for FFF/DM-based 3D printing without supports.

Printing Notes: The idle temperature of the ESPRESSObin is quite warm (around ~53C in certain areas). Please consider printing this case in something like PETG (which has a higher glass transition temperature than PLA and flame-retardant/self-extinguishing properties).

Update 4: There is now a version of the case (espressobin-f2-base-heatsinkable.stl) that has room for a small heatsink on the processor.

Print the case and feet/legs in PETG, then print the covers in TPU if desired. The case may tilt a bit (even with the TPU covers), so cabling will need to be routed appropriately.

Upcoming additions/changes (as time permits):

* Adding different lid configurations for GPIO/SATA access (editable source is provided as espressobin_case.stp for custom modifications)