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Parasolid, SOLIDWORKS 2014, STEP / IGES, STL
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Raspberry Pi B+ Case
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This RPI B+ case is designed for 3D printing. The two components of the case are held together by 4 #2 x 1/2" Pan Head Sheet Metal Screws. I have printed this case in ABS and am currently using it for my RPI B+. A feature that I find useful is that I can access the I/O pins without opening the case. This is also a very sturdy, compact case. Many thanks to trinityscsp for his excellent B+ board model (available on this site) which I designed this case around. I have also designed injection moldable versions of these parts with required draft.
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