SOIL SIEVE

Triple-Layer Bonsai Soil Sieve (3mm / 5mm / 8mm) – Stackable System with TPU Wheels and Bearings This 3D-printable bonsai soil sieve system is designed to drastically speed up substrate preparation by separating different particle sizes in a single pass. The system consists of three stackable sieves (3 mm, 5 mm, and 8 mm mesh) that allow you to efficiently divide your substrate into fine, medium, and coarse fractions without repeating the process multiple times. Integrated TPU wheels with bearings improve stability and handling during use, making the sifting process smoother and more controlled. Key Features: 3-layer stackable design (3mm / 5mm / 8mm) Single-pass granulometric separation TPU wheels for smooth movement and vibration control Bearing-supported structure for better stability Optimized for bonsai substrates Ideal for: akadama pomice lapillo Perfect for bonsai enthusiasts who want a faster, cleaner, and more efficient workflow when preparing soil mixes.